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Interface electronics using 28-nm node CMOS

2023 Tsinghua University Alumni IC Forum Held

Ren Tian-ling’s research group developed an intelligent wearable artificial throat for mixed-modality speech recognition and interaction

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Co-Packaged Optics - Heterogeneous Integration of Photonic IC and Electronic IC
March 30, 2024 14:00
Software Approach to SoC Design
November 16, 2023 15:00 B312 Conference Room, School of Integrated Circuits, Tsinghua University
Seminar on Semiconductor Silicon Material Technology
October 31, 2023 10:00 B312 Conference Room, School of Integrated Circuits, Tsinghua University
A Fully Immersible Digital Deep-Brain Probe for Parallel Neural Recording
October 26, 2023 14:00 B312 Conference Room, School of Integrated Circuits, Tsinghua University
Design Rules and Acceleration for Electromigration-Induced Failure: Coupled Modeling and Experimental Verification
July 28, 2023 15:00 B312 Conference Room, School of Integrated Circuits, Tsinghua University
Chiplet Design and Heterogeneous Integration Packaging
May 11, 2023 14:00 - 16:00, Beijing time Multifunctional Hall of FIT Building,Tsinghua University, Beijing
Seminar on Photolithography Technology
March 28, 2023 15:00 ,Beijing Time(UTC+8) B312 Conference Room, School of Integrated Circuits, Tsinghua University
Photoresist: Past, Present and Future
Oct 20, 2022 14:00-15:30, ,Beijing Time(UTC+8) Multifunctional Hall of FIT Building,Tsinghua University, Beijing
The Next Generation Chip Technology: 3DIC/Chiplet
Oct 28, 2022 9:00-14:30, ,Beijing Time(UTC+8) B312 Conference Room, School of Integrated Circuits, Tsinghua University

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Interface electronics using 28-nm node CMOS

Tsinghua University makes breakthrough in system-integrated memristor computing-in-memory chips

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