Chiplet Design and Heterogeneous Integration Packaging

IEEE Distinguished Lecture

Chiplet Design and Heterogeneous Integration Packaging

Participation:

Presenter: John H.Lau, Unimicron Technology Corporation

Date: May 11, 2023 14:00 - 16:00, Beijing time

Location: Multifunctional Hall of FIT Building,Tsinghua University, Beijing

（清华大学FIT楼多功能厅）

Abstract:

Chiplet is a chip design method and heterogeneous integration is a chip packaging method. Chiplet design and heterogeneous integration packaging have been generated lots of tractions lately. For the next few years, we will see more implementations of a higher level of chiplet designs and heterogeneous integration packaging, whether it is for cost, time-to-market, performance, form factor, or power consumption.

Who Should Attend ?

If you (students, engineers, and managers) are involved with any aspect of the electronics industry, you should attend this course. It is equally suited for R&D professionals and scientists. The lectures are based on the publications by many distinguish authors and the books by the lecturer.

Lecturer Bio:

John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 517 peer-reviewed papers (375 are the principal investigator), 52 issued and pending US patents (32 are the principal inventor), and 23 textbooks (all are the first author), e.g., Chiplet Design and Heterogeneous Integration Packaging (525 pages, Springer, 2023). John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/ academy/ society meetings/ conferences to contribute, learn, and share.