On April 23, the "Gathering Strength to Empower the Development of Chips - 2023 Tsinghua Alumni IC Forum" co-sponsored by the Integrated Circuit Professional Committee of the Tsinghua Alumni Association and the School of Integrated Circuits of Tsinghua University, was held in the rear hall of Tsinghua University's main building. Huikang Shi, Deputy Director of the Department of Electronic Information of the Ministry of Industry and Information Technology, Peixue Jiang, Vice President of Tsinghua University, and Shaojun Wei, Chairman of the Integrated Circuit Professional Committee of Tsinghua Alumni Association, attended the forum. More than 400 alumni from various government departments, integrated circuit companies, colleges and universities attended the forum.
Huikang Shi talked about the continuous expansion of China's integrated circuit industry talent base during recent years and to become a key empowering force leading a new wave of technological revolution and industry changes. He also remarked that Tsinghua University has trained many pioneers and leaders in the national integrated circuit industry and has made important contributions. He pointed out that in tackling the weak links in the integrated circuit industry, it is necessary to further deepen the integration of production and education, accelerate breakthroughs in core technologies, drive commercialization of intellectual achievements, and propel high-quality development in the integrated circuit industry.
Peixue Jiang said that integrated circuit development is the core foundation of the information technology industry, an important symbol of a country's comprehensive strength, and a strategic height for countries around the world in high-tech competition. Tsinghua University will further integrate the country's major strategic needs, build specialty disciplines and innovation systems at internationally leading levels, nurture more leading innovation talents, and continuously endeavor to promote the development of China's integrated circuit industry.
In the themed speech sessions of the forum, guest speakers shared their thoughts on topics such as integrated circuit manufacturing, design, packaging and testing, EDA, industrial chain, and talent nurturing. The sessions were divided into four parts and moderated respectively by Weidong Liu, General Manager of Beijing Jiuhao Micro-electronics Co., Ltd. and Secretary-General of the Integrated Circuit Professional Committee of Tsinghua Alumni Association, Yutao Ma, Vice President of R&D at Primarius, and Deputy Secretary General of the Integrated Circuit Professional Committee of Tsinghua Alumni Association, Feng Gao, Partner of Stony Creek Capital, and Qiwei Ren, CEO of UNISOC (Shanghai).
Shaojun Wei put forward suggestions on the current development of China's integrated circuits with the title of "Current and Future Situation and China's Integrated Circuit Mission". Wei Li, an alumnus from the Class of 1989 and Executive Vice President of National Silicon Industry Group, gave a speech titled "China-Made Large Silicon Wafers Moving Full Steam Ahead". Shengwu Wu, an alumnus from the Class of 1991 and Executive Vice President of Tsinghua Unigroup, gave a speech on the topic of "How Chinese Semiconductor Companies Respond to the Increasingly Complex Environment". Lifeng Wu, an alumnus from the Class of 1979 and Executive Deputy General Manager of Empyrean Technology, gave a speech titled "Accelerating the Construction of a Domestic EDA Full-Chain Ecology". Hong Xie, an alumnus from the Class of 1981 and Deputy General Manager of Tongfu Microelectronics, gave a speech on "The Latest Development and Challenges in Chiplet Technology".
Zhihan Wang, an alumnus from the Class of 1999 and Chairman of Shenzhen BASiC Semiconductor Ltd., made a keynote speech entitled "The Future Has Come: The Silicon Carbide Era of Power Semiconductors". Wei Xia, an alumnus from the Class of 1996 and Vice President of strategic development at NAURA Technology Group, made a keynote speech entitled "Opportunities and Challenges of China's Integrated Circuit Equipment Industry". Jianwen Li, an alumnus from the Class of 1982 and Founder and CEO of Denglin Technology, made a keynote speech entitled “The Challenges in General Large Chips and the Practices of Denglin Technology”. Zhao Guoguang, an alumnus from the Class of 1999 and Vice Chairman and General Manager of Bestechnic, made a speech entitled “Smart Wearable Chips and Terminals Market Development”. Huaqiang Wu, Dean of the School of Integrated Circuits at Tsinghua University, introduced the school's teaching and scientific research with the theme of "Integrating Intelligence to Innovate Chips".
In the hall of the main building, the display of a group innovation and entrepreneurship projects by Tsinghua alumni, such as advanced optical communication chips, the digital intelligence of pan-semiconductor manufacturing, and a new generation of wireless communication RF front-end chips, attracted the attention of many of the participants.
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