刘效森 准聘副教授

联系电话:+86-10-62771283

E-mail:liuxiaosen@tsinghua.edu.cn

通信地址:北京市海淀区bat365官网登录入口自强科技楼2-507

2008年本科毕业于东南大学电子科学与工程学院,2011年硕士毕业于香港科技大学电子与计算机工程系(导师:陈敬IEEE Fellow),2016年博士毕业于美国德克萨斯农工大学电子与计算机工程系(导师:Edgar Sanchez-Sinencio IEEE Life Fellow),2016-2022年在美国英特尔研究院—电路研究室工作,历任研究员、高级研究员、主任研究员,2022年加入bat365官网登录入口任副教授。主要研究方向包括功率集成电路设计电源管理系统III-V族功率半导体电路电子设计自动化。先后获得2020年国家级人才计划、国家优秀自费留学生奖、IEEE固态电路学会杰出博士奖、四次荣获英特尔研究院杰出贡献奖等奖项。曾作为技术带头人,领导数字/混合信号的研究团队,专注未来芯片的电源管理架构、10纳米以下先进工艺的高性能电子设计自动化、硬件安全的集成功率构架等项目研究。推动了英特尔酷睿、至强®系列高性能中央处理器,PCH主板芯片组,XMM系列5G Modem,x86架构AES指令集等核心产品,以及发明了Sonicision新一代电超声手术刀,提出了物联网能源采集的早期主要架构。先后主持或参与美国国家自然科学基金、美国国防部高级研究计划局、英特尔、美敦力、德州仪器等资助的研究项目。近年来作为负责人承担过包括国家重点研发计划、国家自然科学基金等研究项目或课题;在ISSCC、IEDM、VLSI、JSSC、TED、TIE等发表论文超过40篇,美国发明专利30余项(已授权11项),担任IEEE DAC、ISCAS等国际会议的技术委员会成员和美国半导体研究联盟的协调人。


招生/招聘信息本课题组每年招收2-4名博士/硕士研究生,常年招聘数字芯片、混合信号电路电源管理电子设计自动化等方向博士后,同时也非常欢迎感兴趣的本科生参与科研。详情请附上简历咨询liuxiaosen@tsinghua.edu.cn.


代表性成果Selected Publications

专利Patents

■ U.S. Patent No. 010086217B2, “Electrosurgical Ultrasonic Vessel Sealing and Dissecting System,” X. Liu, A. I. Collie-Menchi, J. A. Gilbert, D. A. Friedrichs, K. W. Malan, and E. Sánchez-Sinencio, Covidien.

■ U.S. Patent No. 20180284823A1, “Supply Generator with Programmable Power Supply Rejection Ratio,” X. Liu, T. Na, and H. K. Krishnamurthy, Intel Corporation.

■ U.S. Patent No. US10530254B2, “Peak Delivered Power Circuit for a Voltage Regulator,” K. Ahmed, V. De, N. Desai, S. Kim, K. Krishnamurthy, X. Liu, T. Majumder, K. Ravichandran, C. Schaef, V. Vaidya, and S. Vangal, Intel.

■ U.S. Patent No. 20190006939A1, “Master-Slave Controller Architecture Technical Field,” H. Krishnamurthy, K. Ahmed, V. De, N. Desai, S. Kim, X. Liu, T. Majumder, K. Ravichandran, C. Schaef, V. Vaidya, and S. Vangal, Intel Corporation.

■ U.S. Patent No. US10958079B2, “Energy Harvester with Multiple-Input Multiple-Output Switched Capacitor (MIMOSC) Circuitry,” X. Liu, K. Ahmed, V. De, N. Desai, S. Kim, H. Krishnamurthy, T. Majumder, K. Ravichandran, C. Schaef, V. Vaidya, and S. Vangal, Intel.

U.S. Patent No. 20210203228A1, “Non-Linear Clamp Strength Tuning Method and Apparatus,” X. Liu, H. Krishnamurthy, K. Ravichandran, and V. De, Intel.

■ U.S. Patent No. US10845831B2, “Techniques in Hybrid Regulators of High Power Supply Rejection Ratio and Conversion Efficiency,” X. Liu, C. Barrera, H. Krishnamurthy, J. Han, K. Ravichandran, R. Narayana Bhatla, S. Chiu, and V. De, Intel Corporation.

■ U.S. Patent No. 010474174B2, “Programmable Supply Generator,” T. Na, H. K. Krishnamurthy, and X. Liu, Intel.

■ U.S. Patent No. US10897364B2, “Physically Unclonable Function Implemented with Spin Orbit Coupling Based Magnetic Memory,” V. De, K. Ravichandran, H. Krishnamurthy, K. Ahmed, S. Vangal, V. Vaidya, T. Majumder, C. Schaef, S. Kim, X. Liu, and N. Desai, Intel.

■ U.S. Patent No. 20190094931A1, “Energy Harvesting Source and Ambient Condition Tracking in IoT for Adaptive Sensing and Self-modifying Application Code,” K. Ahmed, V. De, N. Desai, S. Kim, H. Krishnamurthy, X. Liu , T. Majumder, K. Ravichandran, C. Schaef, V. Vaidya, and S. Vangal, Intel.

■ U.S. Patent No. US20200350817A1, “Multiple Output Voltage Conversion,” V. De, K. Ravichandran, H. Krishnamurthy, K. Ahmed, S. Vangal, V. Vaidya, T. Majumder, C. Schaef, S. Kim, X. Liu, and N. Desai, Intel.


期刊Journals

■ J. Yang, M. Wang, J. Yu , Y. Wu, J. Cui, T. Li, H. Yang, J. Wang, X. Liu, X. Yang, B. Shen, and J. Wei, “Virtual-Body p-GaN Gate HEMT With Enhanced Ruggedness Against Hot-Electron-Induced Degradation,” IEEE Electron Device Letters (EDL), vol. 45, no. 5, pp. 770-773, May 2024.

■ S. Yin, R. Wang, J. Zhang, X. Liu, and Y. Wang, “Automatic Design for W-Band Front-End System via Bottom-Up Sizing and Layout Generation,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 43, no. 3, pp. 705-715, March 2024.

■ J. Yang, J. Wei, Y. Wu, J. Yu, J. Cui, X. Yang, X. Liu, J. Wang, Y. Hao, M. Wang, and B. Shen, “Enhanced robustness against hot-electron-induced degradation in active-passivation p-GaN gate HEMT,” Applied Physics Letters (APL), 4 March 2024;

■ J. Cui, Y. Wu, J. Yang, J. Yu, T. Li, X. Liu, K. Cheng, X. Yang, Y. Hao, J. Wang, B. Shen, M. Wang, and J. Wei, “High-Voltage E-Mode p-GaN Gate HEMT on Sapphire With Gate Termination Extension,” IEEE Transactions on Electron Devices (TED), vol. 71, no. 3, pp. 1592-1597, March 2024.

■ Y. Wu, M. Nuo, J. Yang, W. Lin, X. Liu, X. Yang, J. Wang, Y. Hao, B. Shen, M. Wang, and Jin Wei, “Suppression of Buffer Trapping Effect in GaN-on-Si Active-Passivation p-GaN Gate HEMT via Light/Hole Pumping,” IEEE Transactions on Electron Devices (TED), vol. 71, no. 1, pp. 484-489, Jan. 2024.

■ J. Cui, M. Wang, Y. Wu, J. Yang, H. Yang, J. Yu, T. Li, X. Yang, X. Liu, K. Cheng, J. Wang, B. Shen, and J. Wei, “Demonstration of 1200-V E-Mode GaN-on-Sapphire Power Transistor With Low Dynamic ON-Resistance Based on Active Passivation Technique,” IEEE Electron Device Letters (EDL), vol. 45, no. 2, pp. 220-223, Feb. 2024.

■ X. Liu, S. Yaldiz, P. Mukherjee, S. Burns, H. Krishnamurthy, K. Ravichandran, Z. Ahmed, N. Desai, N. Butzen, J. Tschanz, and Vivek De, “A Digital LDO in 22-nm CMOS With a 4-b Self-Triggered Binary Search Windowed Flash ADC Featuring Analog Layout Generator Framework,” IEEE Solid-State Circuits Letters (SSCL), vol. 6, pp. 101-104, 2023.

■ S. Yin, R. Wang, J. Zhang, X. Liu and Y. Wang, “Fast Surrogate-Assisted Constrained Multiobjective Optimization for Analog Circuit Sizing via Self-Adaptive Incremental Learning,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 42, no. 7, pp. 2080-2093, July 2023.

■ X. Wang, X. Liu and W. -H. Ki, “A Self-Clocked and Variation-Tolerant Unified Voltage-and-Frequency Regulator for In-Order Executed Digital Loads,” IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), vol. 70, no. 11, pp. 4627-4640, Nov. 2023.

■ D. Das, M. Nath, B. Chatterjee, R. Kumar, X. Liu, H. Krishnamurthy, M. Sastry, S. Mathew, S. Ghosh, and S. Sen, “EM SCA White-box Analysis Based Reduced Leakage Cell Design and Pre-Silicon Evaluation,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 11, pp. 4927-4938, Nov. 2022.

■ X. Liu, H. K. Krishnamurthy, T. Na, S. Weng, Z. Ahmed, K. Ravichandran, J. Tschanz, and V. De, “A Universal Modular Hybrid LDO with Fast Load Transient Response and Programmable PSRR in 14-nm CMOS Featuring Dynamic Clamp Strength Tuning,” IEEE Journal of Solid-State Circuits (JSSC), invited, 2021.

■ R. Kumar, X. Liu, V. Suresh, H. K. Krishnamurthy, S. Satpathy, M. Anders, K. Himanshu, K. Ravichandran, V. De, and S. K. Mathew, “A Time/Frequency-domain Side-channel Attach Resistant AES-128 and RSA-4K Crypto-Processor in 14nm CMOS,” IEEE Journal of Solid-State Circuits (JSSC), invited, vol. 56, no. 4, pp. 1141-1151, Apr. 2021.

■ X. Liu, H. K. Krishnamurthy, C. Barrera, J. Han, R. M. Narayana Bhatla, S. Chiu, Z. K. Ahmed, N. Desai, K. Ravichandran, J. W. Tschanz, V. De, “A Dual-Rail Hybrid Analog/Digital Low Dropout Regulator with Dynamic Current Steering for a Tunable High PSRR and High Efficiency,” IEEE Solid-State Circuits Letters, vol. 3, pp. 526-529, 2020.

■ Z. Ahmed, H. Krishnamurthy, C. Augustine, X. Liu, W. Sheldon, K. Ravichandran, J. Tschanz, and V. De, “A Variation-Adaptive Integrated Computational Digital LDO in 22-nm CMOS With Fast Transient Response,” IEEE Journal of Solid-State Circuits (JSSC), invited, vol. 55, no. 4, pp. 977-987, Apr. 2020.

■ C. Schaef, D. Nachiket, K. Harish, X. Liu, Z. Ahmed, K. Suhwan, W. Sheldon, H. Do, W. Lambert, K. Ravichandran, K. Radhakrishnan, J. Tschanz, and V. De, “A Light-Load Efficient Fully Integrated Voltage Regulator in 14 nm CMOS with 2.5 nH Package-Embedded Air-Core Inductors,” IEEE Journal of Solid-State Circuits (JSSC), invited, vol. 54, no. 12, pp. 3316-3325, Dec. 2019.

■ H. Krishnamurthy, V. Vaidya, P. Kumar, R. Jain, S. Weng, S. Kim, G. Matthew, N. Desai, X. Liu, K. Ravichandran, J. Tschanz, and V. De, “A Digitally Controlled Fully Integrated Voltage Regulator with On-Die Solenoid Inductor with Planar Magnetic Core in 14nm Tri-Gate CMOS,” IEEE Journal of Solid-State Circuits (JSSC), invited, vol. 53, no. 1, pp. 8-19, Jan. 2018.

■ X. Liu, A. Colli-Menchi, and E. Sanchez-Sinencio, “Ultrasonic Electric Scalpels Based on a Sliding-Mode Controller With an Auxiliary PLL Frequency Discriminator,” IEEE Transaction on Biomedical Circuits and Systems (BioCAS), invited, vol. 11, no. 6, pp. 1226-1235, Dec. 2017.

■ X. Liu, L. Huang, K. Ravichandran, and E. Sanchez-Sinencio, “A Highly Efficient Reconfigurable Charge Pump Energy Harvester with Wide Harvesting Range and Two-Dimensional MPPT for Internet of Things,” IEEE Journal of Solid-State Circuits (JSSC), vol. 51, no. 5, pp. 1302-1312, May 2016.

■ X. Liu and E. Sanchez-Sinencio, “An 86% Efficiency 12 μW Self-sustaining PV Energy Harvesting System with Hysteresis Regulation and Time-domain MPPT for IOT Smart Nodes,” IEEE Journal of Solid-State Circuits (JSSC), vol. 50, no. 6, pp. 1424-1437, Mar. 2015.

■ X. Liu, A. Colli-Menchi, J. Gilbert, D. Friedrichs, K. Malang, and E. Sanchez-Sinencio, “An Automatic Resonance Tracking Scheme With Maximum Power Transfer for Piezoelectric Transducers,” IEEE Transactions on Industrial Electronics (TIE), vol.62, no.11, pp.7136-7145, Nov. 2015.

■ A.M.H. Kwan, G. Yue, X. Liu, K.J. Chen, “A Highly Linear Integrated Temperature Sensor on a GaN Smart Power IC Platform,” IEEE Transactions on Electron Devices (TED), vol. 61, no. 8, pp. 2970-2976, Aug. 2014.

■ X. Liu, K. J. Chen, “GaN Single-Polarity Power Supply Bootstrapped Comparator for High Temperature Electronics,” IEEE Electron Device Letters (EDL), vol. 32, No. 1, pp. 27-29, Jan. 2011.


会议Conference Proceedings

■ C. Hu, X. Huang, X. Liu, S. Du, X. Liu, and J. Jiang, “A 3.6W 16V-Output 180ns-Response-Time 94%-Efficiency SC Sigma Converter with Output Impedance Compensation and Ripple Mitigation for LiDAR Driver Applications,” IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, CA, USA, 2024, pp. 508-510.

■ S. Kim, H. K Krishnamurthy, Z. Ahmed, N. Desai, S. Weng, A. Augustine, H. T. Do, J. Yu, P. D. Bach, X. Liu, K. Radhakrishnan, K. Ravichandran, J. W. Tschanz, and V. De, “A Monolithic 10.5W/mm2600 MHz Top-Metal and C4 Planar Spiral Inductor-Based Integrated Buck Voltage Regulator on 16nm-Class CMOS,” IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, CA, USA, 2024, pp. 270-272.

■ Z. Wang, J. Zhou, X. Liu and Y. Wang, “An Efficient Transfer Learning Assisted Global Optimization Scheme for Analog/RF Circuits,” 29th Asia and South Pacific Design Automation Conference (ASP-DAC), Incheon, Korea, Republic of, 2024, pp. 417-422.

■ J. Cui, J. Wei, M. Wang, Y. Wu, J. Yang, T. Li, J. Yu, H. Yang, X. Yang, J. Wang, X. Liu, D. Ueda, B. Shen, “6500-V E-mode Active-Passivation p-GaN Gate HEMT with Ultralow Dynamic RON,” International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 2023, pp. 1-4.

■ X. Liu, S. Yaldiz, P. Mukherjee, S. Burns, H. Krishnamurthy, K. Ravichandran, Z. Ahmed, N. Desai, N. Butzen, J. Tschanz, and V. De, “A Digital LDO in 22nm CMOS with a 4b Self-triggered Binary Search Windowed Flash ADC Featuring Automatic Analog Layout Generator Framework,” IEEE Asian Solid-State Circuits Conference (A-SSCC), Taipei, Taiwan, 2022, pp. 2-4.

■ H. Wang, R. Liu, R. Dorrance, D. Dasalukunte, X. Liu, D. Lake, B. Carlton, and M. Wu, “A 32.2 TOPS/W SRAM Compute-in-Memory Macro Employing a Linear 8-bit C-2C Ladder for Charge Domain Computation in 22nm for Edge Inference,” IEEE Symposium on VLSI Technology and Circuits (VLSI), Honolulu, HI, USA, 2022, pp. 36-37.

■ X. Liu, H. Krishnamurthy, R. Liu, K. Ravichandran, Z. Ahmed, N. Desai, N. Butzen, J. Tschanz, and V. De, “A 0.76V Vin Triode Region 4A Analog LDO with Distributed Gain Enhancement and Dynamic Load-Current Tracking in Intel 4 CMOS Featuring Active Feedforward Ripple Shaping and On-Chip Power Noise Analyzer,” IEEE International Solid-State Circuits Conference (ISSCC), pp. 478-479, Feb. 2022.

■ Z. Ahmed, N. Desai, H. Krishnamurthy, S. Weng, X. Liu, K. Ravichandran, J. Tschanz, and V. De, “A Dual-Input, Digital Hybrid Buck-LDO System Featuring Fast Load Transient Response, Zero-Wire Current Handover & Input PDN Resonance Reduction,” IEEE Symposia on VLSI Technology & Circuits (VLSI), Jun. 2021.

■ n N. Desai, H. Krishnamurthy, Z. Ahmed, S. Weng, S. Kim, X. Liu, H. Do, K. Radhakrishnan, K. Ravichandran, J. Tschanz, V. De, “Peak-Current-Controlled Ganged Integrated High-Frequency Buck Voltage Regulators in 22nm CMOS for Robust Cross-Tile Current Sharing,” IEEE International Solid-State Circuits Conference (ISSCC), pp. 262-263, Feb. 2021.

■ X. Liu, H. Krishnamurthy, C. Barrera, J. Han, R. Narayana Bhatla, S. Chiu, Z. Ahmed, K. Ravichandran, J. Tschanz, and V. De, “A Dual-Rail Hybrid Analog/Digital LDO with Dynamic Current Steering for Tunable High PSRR & High Efficiency,” IEEE Symposia on VLSI Technology & Circuits (VLSI), Jun. 2020.

■ R. Kumar, X. Liu, V. Suresh, H. Krishnamurthy, M. Anders, H. Kaul, K. Ravichandran, V. De, and S. Mathew, “A SCA-Resistant AES Engine in 14nm CMOS with Time/Frequency-Domain Leakage Suppression using Non-linear Digital LDO Cascaded with Arithmetic Countermeasures,” IEEE Symposia on VLSI Technology & Circuits (VLSI), Jun. 2020.

■ Z. Ahmed, H. Krishnamurthy, S. Weng, X. Liu, C. Schaef, N. Desai, K. Ravichandran, J. Tschanz, and V. De, “An Autonomous Reconfigurable Power Delivery Network (RPDN) for Many-Core SoCs Featuring Dynamic Current Steering,” IEEE Symposia on VLSI Technology & Circuits (VLSI), Jun. 2020.

■ Z. Ahmed, H. Krishnamurthy, C. Augustine, X. Liu, S. Weng, K. Ravichandran, J. Tschanz, and V. De, “A Variation-Adaptive Integrated Computational Digital LDO in 22nm CMOS with Fast Transient Response,” IEEE Symposia on VLSI Technology & Circuits (VLSI), pp. 124-125, Jun. 2019.

■ X. Liu, H. K Krishnamurthy, T. Na, S. Weng, K. Z Ahmed, K. Ravichandran, J. Tschanz, V. De, “A Modular Hybrid LDO with Fast Load-Transient Response and Programmable PSRR in 14nm CMOS Featuring Dynamic Clamp Tuning and Time-Constant Compensation,” IEEE International Solid-State Circuits Conference (ISSCC), pp. 234-235, Feb. 2019.

■ S. Kim, V. Vaidya, C. Schaef, A. Lines, H. Krishnamurthy, S. Weng, X. Liu, D. Kurian, T. Karnik,K. Ravichandran, J. Tschanz, and V. De, “A Single-Stage, Single-Inductor, 6 Input 9 Output Multi-Modal Energy Harvesting Power Management IC for 100µW-120mW Battery Powered IoT Edge Nodes,” IEEE Symposia on VLSI Technology and Circuits (VLSI), pp. 195-196, Jun. 2018.

■ X. Liu, A. Colli-Menchi, and E. Sanchez-Sinencio, “A Reduced-Order Sliding-Mode Controller with an Auxiliary PLL Frequency Discriminator for Ultrasonic Electric Scalpels,” IEEE International Solid-State Circuits Conference (ISSCC), pp. 358-359, Feb. 2017.

■ X. Liu and E. Sanchez-Sinencio, “A Single-cycle MPPT Charge Pump Energy Harvester using a Thyristor-based VCO without Storage Capacitor,” IEEE International Solid-State Circuits Conference (ISSCC), pp. 364-365, Feb. 2016.

■ X. Liu and E. Sanchez-Sinencio, “A 0.45-to-3V Reconfigurable Charge-Pump Energy Harvester with Two-Dimensional MPPT for Internet of Things,” IEEE International Solid-State Circuits Conference (ISSCC), pp. 370-371, Feb. 2015.

■ A. M. H. Kwan, X. Liu, and K. J. Chen, “Integrated gate-protected HEMTs and mixed-signal functional blocks for GaN smart power ICs,” IEEE International Electron Devices Meeting (IEDM), pp.7.3.1-4, Dec. 2012.