Jian Cai Professor

Contact number: 86-10-62781852

E-mail：jamescai@tsinghua.edu.cn

Jian Cai received the bachelor degree in materials science and engineering and the Ph.D. degree in metallic materials and heat treatment from Tsinghua University, Beijing, China, in 1993 and 1998, respectively. He joined the Central South University, Changsha, China in 1999 as a lecturer and had been as a Visiting Scholar in Hong Kong University of Science & Technology from 1999 to 2001. From 2001 to 2002, he was with STI (Shenzhen) Ltd. as the R&D supervisor. Dr. Cai joined Tsinghua University in 2002 and now is a professor.

He is an IEEE senior member. He serves as the member of council of China's EMPT society, Packaging society. He is also the member of council of China's IC Packaging & Testing Technology Innovation Consortium. Jian Cai is the Interconnection Committee member of ECTC.

His current research works focus on advanced packaging (ultra-fine pitch flip chip, interconnections in 3D integration, high density substrates, etc.), System-in-Packaging and Heterogenous integration, materials in electronic packaging, packaging reliability and failure analysis. He gives a lecture on advanced packaging and system integration for graduate student.