Zhang Chun Professor
Tel：010-62792912
E-mail：zhangchun@tsinghua.edu.cn
He graduated from the Department of Electronic Engineering of Tsinghua University with a bachelor degree in 1995, from the Department of Electronic Engineering of Tsinghua University with a doctor's degree in engineering in 2000. In the same year, he worked in the Department of Electronic Engineering of Tsinghua University. He is now the director of the Institute of Integrated Circuit Design, School of Integrated Circuits, Tsinghua University. His research work focused on mixed signal integrated circuit design, digital signal processing, radio frequency identification, high-speed serial communication, intelligent robots, and more.
As the project leader, he has successively undertaken the national major special project "Development of High Speed Serial Interface IP Core", 863 project "Research on Key Technologies of Mass Storage of Mobile Intelligent Terminal", "Development and Industrialization of Super high frequency (UHF) Reader Writer Chip", 973 project "Design of Implantable Wireless Micro current Stimulator", The Natural Science Foundation project "Research on Key Technologies of High Speed Serial Interface PHY Applied to Next Generation 100Gbps Ethernet", "Research on Several Issues of Real time Image Compression in Space Vehicles", the Beijing Science and Technology Plan project "Research on Ultra Small and Ultra Thin RFID Label Technology".
Lectured on graduate courses such as "Design of Structured Integrated Circuit", "Design of Digital Integrated System", "IC Design and Methods", "Intelligent Robot Design and Practice", undergraduate courses such as "Integrated Circuit Design and Practice" and "SOPC Technology and Applications", published over 100 academic papers, 5 books, and applied for over 60 patents.
Since 2019, he has served as the director of the Technical Committee of the International Autonomous Intelligent Robot Competition ( http://www.running-robot.net/ ), responsible for the technical aspects of the competition rules, event arrangement, technology roadmap and so on.
