Qian Wang Associate Professor

Qian Wang, Ph. D

Associate Professor, School of Integrated Circuit, Tsinghua University

Executive member, Packaging & Test branch, China Semiconductor Industry Association

Qian Wang received Ph. D in 2001 from Tsinghua University, china. Then started postdoctoral work at RCAST (Research Center for Advanced Science & Technology), the University of Tokyo and NIMS(National Institute for Materials Science) in Japan until 2003. From 2003.8, he joined Samsung and worked in SAIT （Samsung Advanced Institute of Technology) as a senior engineer. From 2006 to 2009, he went back to mainland China and worked in Samsung SSCR as a principle engineer and leader of Technology Development Group. Since 2010.3, he joined Institute of Microelectronics, Tsinghua University as an Associate Professor.

His research focus on advanced packaging technologies such as SiP, MEMS Packaging, WLP, 3D integration, Chiplet integration and Heterogeneous Integration etc.Packaging reliability and failure analysis.