Zheyao Wang Professor

Zheyao Wang was born in Nei Mongol in 1972. He received his B.S. Degree in 1995 and Ph.D degree in 2000, both from Tsinghua University, Beijing, China. During 2000-2003, he served as a postdoc in the Institute of Microelectronics, Tsinghua University, Beijing, China, and Delft Institute of Microelectronics and Submicron Technology (DIMES), Delft University of Technology, Delft, the Netherlands. He joined the Institute of Microelectronics, Tsinghua University，as a faculty in 2003. He was promoted as an associated professor and a full professor in 2003 and 2008, respectively. He currently is a tenured full professor.

His research mainly focuses on MEMS, Micro/nano sensors, and 3D/chiplet integration. He published more than 120 journal papers and 60 conference papers, and filed 20 patents. He was selected as Beijing Science and Technology Novel Star, and the New Century Excellent Talents of the Ministry of Education. His research projects were funded by China National Science Foundations, 973 Program and 863 Program from the Ministry of Science and Technology, and the industrial companies including Intel, ABB, and Lam Research.

He is currently a senior member of IEEE and a member of the council of China instrument and control society and China Micro/Nano Technology Society. He also served as the members of the technical council of IEEE Sensors Conference, IEEE MEMS, IEEE EADPS, IEEE NEMS, Transducers and CSTIC.

His main research areas include,

1. 3D integration technology and chiplet technology：Fabrication technology for through-silicon-vias (TSV), Chip- and Wafer-level hybrid bonding, high-density metal bump boding, and system integration.

2. MEMS and Micro/Nano sensors: Novel micro/nano sensors, RF MEMS, and sensor arrays.

3、Microfabrication technology：Fabrication of 3D microstructures, polymer and metal microfabrication, and integration of microsensors and CMOS.